The application of the GOB process is becoming more and more extensive, especially the current popularity of small-pitch LED modules, and more and more modules adopt the gob process.
Because the small-pitch module has dense lamp beads and extremely small lamp feet, it is easy to receive a collision during use and transportation, and the product will be defective, and many customers do not know how to repair the small-pitch module. Therefore, in many use cases, customers will choose the GOB process.
The picture below can clearly see the comparison of the lamp surface before and after the glue.
