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Shenzhen Sanco Optoelectronics Technology CO., Ltd

Dongguan LEK Electronic Technology Co., Ltd


Shenzhen Sanco Optoelectronics Technology CO., Ltd

Shenzhen Factory: 2 Floor, Buliding A, Tongduyu Industry Park, Fuhai Street,  Fuyong,  Shenzhen, China

Any Inquiry Contact us 24/7. Mail will be responded within 24 Hours 

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Tel: +8613926878165  (Whatsapp, Viber, Wechat)

GOB LED Module

GOB Technology is an innovative sealing on module surface with an epoxy Glue. It is a great protecting of the LED on the LED Modules from Water, dust and damage. 

GOB means Glue on board.

  1. It is a kind of packaging technology. It is a technology to solve the problem of LED lamp protection.

  2. It uses an advanced new transparent material to package the substrate and its LED package unit to form effective protection.

  3. This material not only has ultra-high transparency, but also has superior thermal conductivity.

  4. The GOB can be adapted to any harsh environment with a small gap to achieve true moisture, water, dust, impact and UV resistance.

gob on board technology

can be applied on

all led modules